Mounting structure for module in electronic device

ABSTRACT

An electronic device is provided. The electronic device includes a display including a display area and a connecting area extending from one side of the display area, a flexible printed circuit board (FPCB) connected with the connecting area, and a first module mounted on a first surface of the FPCB, where the connecting area is bent such that the first module is apart from the display to face the display.

PRIORITY

This application claims priority under 35 U.S.C. § 119(a) to a KoreanPatent Application filed on Dec. 5, 2016, in the Korean IntellectualProperty Office and assigned Serial number 10-2016-0164694, and to aKorean Patent Application filed on Mar. 10, 2017, in the KoreanIntellectual Property Office and assigned Serial number 10-2017-0030680,the entire disclosure of each of which is incorporated herein byreference.

BACKGROUND

1. Field of the Disclosure

The present disclosure relates generally to mounting structures forhardware modules included in electronic devices.

2. Description of the Related Art

Portable electronic devices, which are equipped with a display, such assmartphones, wearable devices, and the like are widely supplied sincethe spread of personal computers. The display of the portable electronicdevice may be implemented with a touch screen display including a touchpanel. The touch screen display may function as an input device that isable to receive a user manipulation, in addition to a visual displaydevice.

The size of the touch screen display mounted in the portable electronicdevice (e.g., a smartphone) tends to range from 3 inches to 5 inches orlarger to satisfy user demand. According to a trend to enlarge the touchscreen display, the touch screen display may occupy most parts of afront surface of the electronic device.

SUMMARY

The present disclosure has been made to address at least theabove-mentioned problems and/or disadvantages and to provide at leastthe advantages described below.

Accordingly, an aspect of the present disclosure is to provide mountingstructures in an electronic device for hardware modules (e.g., pressuresensors, biometric sensors, and the like) disposed below a touch screendisplay of the electronic device, when the touch screen displayconstitutes substantially the entire front appearance of the electronicdevice, and an electronic device including the same.

Accordingly, another aspect of the present disclosure is to provide thefunctions of hardware modules of an electronic device which are mountedbelow a display that is disposed on substantially the entire area of afront surface of the electronic device, without negatively affecting thedisplay and touch input functions of the display.

In accordance with an aspect of the present disclosure, an electronicdevice is provided. The electronic device includes a display including adisplay area and a connecting area extending from one side of thedisplay area, a flexible printed circuit board (FPCB) connected with theconnecting area, and a first module mounted on a first surface of theFPCB, where the connecting area is bent such that the first module isapart from the display to face the display.

In accordance with another aspect of the present disclosure, anelectronic device is provided. The electronic device includes a flexibleprinted circuit board (FPCB) including a planar area and a bent area, asensor mounted on a first surface of the planar area, and a displayconnected with the bent area, where the bent area is bent such that thesensor is apart from the display to face the display.

In accordance with another aspect of the present disclosure, a displaydevice is provided. The display device includes a display panel having aplurality of pixels to display content, a flexible member including afirst area making contact with one surface of the display panel and asecond area extending from the one surface of the display panel, adisplay driver integrated circuit disposed in the second area of theflexible member, a flexible printed circuit board (FPCB) connected withthe second area, and a biometric sensor mounted on one surface of theFPCB.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more apparent from the following description taken inconjunction with the accompanying drawings, in which:

FIG. 1 is a block diagram of a network environment including anelectronic device, according to an embodiment of the present disclosure;

FIG. 2 is a block diagram of a configuration of an electronic device,according to an embodiment of the present disclosure;

FIG. 3 illustrates a front view of an electronic device, according to anembodiment of the present disclosure;

FIG. 4 illustrates an exploded perspective view of an electronic device,according to an embodiment of the present disclosure;

FIGS. 5A and 5B illustrate a display device of an electronic device,according to an embodiment of the present disclosure;

FIGS. 6A and 6B illustrate mounting structures for hardware modules inan electronic device, according to an embodiment of the presentdisclosure;

FIGS. 7A and 7B illustrate mounting structures for hardware modules ofan electronic device, according to an embodiment of the presentdisclosure;

FIGS. 8A and 8B illustrate mounting structures for hardware modules ofan electronic device, according to an embodiment of the presentdisclosure;

FIG. 9 illustrates a mounting structure for a biometric sensor and apressure sensor, according to an embodiment of the present disclosure;

FIG. 10 illustrates mounting structures for biometric sensors andpressure sensors, according to an embodiment of the present disclosure;

FIGS. 11A and 11B illustrates flexible printed circuit board (FPCB)mounting structures for biometric sensors and pressure sensors,according to an embodiment of the present disclosure;

FIG. 12 is a flowchart of a fingerprint verification method, accordingto an embodiment of the present disclosure; and

FIG. 13 illustrates a fingerprint verification method, according to anembodiment of the present disclosure.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE PRESENT DISCLOSURE

Hereinafter, various embodiments of this disclosure will be describedwith reference to accompanying drawings, in which similar elements maybe marked by similar reference numerals. However, this descriptionprovided herein is not intended to limit the present disclosure to thedescribed embodiments and those skilled in the art will recognize thatmodifications, equivalents, and/or alternatives of the variousembodiments described herein can be made without departing from thescope and spirit of this disclosure. In this disclosure, the expressions“have”, “include” and “comprise”, indicate the existence ofcorresponding features (e.g., elements such as numeric values,functions, operations, or components) but do not exclude the presence ofadditional features.

In this disclosure, the expressions “A or B”, “at least one of A or/andB”, or “one or more of A or/and B”, may include any and all combinationsof one or more of the associated listed items. For example, the term “Aor B”, “at least one of A and B”, or “at least one of A or B” may referto the case (1) where A is included, the case (2) where B is included,or the case (3) where both A and B are included.

In this disclosure, terms such as “first”, “second”, and the like areused to refer to various elements regardless of the order and/or thepriority and to distinguish the relevant elements from other elements,but do not limit the elements. For example, “a first user device” and “asecond user device” indicate different user devices regardless of theorder or the priority. For example, a first element may be referred toas a second element, and similarly, a second element may be referred toas a first element.

It will be understood that when an element (e.g., a first element) isreferred to as being “coupled” or “connected” with/to another element(e.g., a second element), the element may be directly coupled orconnected with/to the other element or an intervening element (e.g., athird element) may be present. In contrast, when an element (e.g., afirst element) is referred to as being “directly coupled” or “directlyconnected” with/to another element (e.g., a second element), it shouldbe understood that there is no intervening element (e.g., a thirdelement).

According to the situation, the expression “configured to” used in thisdisclosure may be used interchangeably with the expressions “suitablefor”, “having the capacity to”, “designed to”, “adapted to”, “made to”,or “capable of'. The term “configured to” does not mean only“specifically designed to” in hardware. Instead, the expression “adevice configured to” may mean that the device is “capable of” operatingtogether with another device or other components. For example, a“processor configured to (or set to) perform A, B, and C” may mean adedicated processor (e.g., an embedded processor) for performing acorresponding operation or a generic-purpose processor (e.g., a centralprocessing unit (CPU) or an application processor (AP)) which performscorresponding operations by executing one or more software programswhich are stored in a memory device.

Terms used in this disclosure are used to describe specified embodimentsand are not intended to limit the scope of another embodiment. The termsof a singular form may include plural forms unless otherwise specified.Unless otherwise indicated herein, all the terms used herein, whichinclude technical or scientific terms, may have the same meanings thatare generally understood by those skilled in the art to which thisdisclosure pertains. It should be understood that terms that are definedin a general dictionary and are commonly used should be interpreted ashaving meanings equivalent to those which are customary in the relevantart, and should not be interpreted in an idealized or overly formalmanner, unless expressly so defined in this disclosure. In some cases,even if certain terms are defined in this disclosure, they may not beinterpreted to exclude embodiments of this disclosure.

An electronic device according to various embodiments of the presentdisclosure may include at least one of smartphones, tablet personalcomputers (PCs), mobile phones, video telephones, electronic bookreaders, desktop PCs, laptop PCs, netbook computers, workstations,servers, personal digital assistants (PDAs), portable multimedia players(PMPs), motion picture experts group (MPEG-1 or MPEG-2) audio layer 3(MP3) players, mobile medical devices, cameras, or wearable devices. Thewearable device may include at least one of an accessory type (e.g.,watches, rings, bracelets, anklets, necklaces, glasses, contact lens, orhead-mounted-devices (HMDs), a fabric or garment-integrated type (e.g.,an electronic apparel), a body-attached type (e.g., a skin pad ortattoos), or a bio-implantable type (e.g., an implantable circuit).

The electronic device may be a home appliance. The home appliances mayinclude at least one of televisions (TVs), digital versatile disc (DVD)players, audio devices, refrigerators, air conditioners, cleaners,ovens, microwave ovens, washing machines, air cleaners, set-top boxes,home automation control panels, security control panels, TV boxes (e.g.,Samsung HomeSync™, Apple TV™, and Google TV™), game consoles (e.g.,Xbox™ and PlayStation™), electronic dictionaries, electronic keys,camcorders, electronic picture frames, and the like.

The electronic device may include at least one of various medicaldevices (e.g., various portable medical measurement devices (e.g., bloodglucose monitoring devices, heartbeat measuring devices, blood pressuremeasuring devices, body temperature measuring devices, and the like),magnetic resonance angiography (MRA) devices, magnetic resonance imaging(MRI) devices, computed tomography (CT) devices, scanners, andultrasonic devices), navigation devices, global navigation satellitesystems (GNSS), event data recorders (EDRs), flight data recorders(FDRs), vehicle infotainment devices, electronic equipment for vessels(e.g., navigation systems and gyrocompasses), avionics, securitydevices, head units for vehicles, industrial or home robots, automaticteller machines (ATMs), point of sales (POSs) devices, or Internet ofthings (IoT) devices (e.g., light bulbs, various sensors, electric orgas meters, sprinkler devices, fire alarms, thermostats, street lamps,toasters, exercise equipment, hot water tanks, heaters, boilers, and thelike).

The electronic device may include at least one of parts of furniture orbuildings/structures, electronic boards, electronic signature receivingdevices, projectors, or various measuring instruments (e.g., watermeters, electricity meters, gas meters, or wave meters, and the like).

The electronic device may be a flexible electronic device.

The electronic device may be one of the above-described devices or acombination thereof. Furthermore, the electronic device may not belimited to the above-described electronic devices and may include otherelectronic devices and new electronic devices according to futuretechnology developments.

In this disclosure, the term “user” may refer to a person who uses anelectronic device or may refer to a device (e.g., an artificialintelligence electronic device) that uses the electronic device.

FIG. 1 is a block diagram of a network environment including anelectronic device, according to an embodiment of the present disclosure.

Referring to FIG. 1, a network environment 100 including an electronicdevice 101 is provided. The electronic device 101 includes a bus 110, aprocessor 120, a memory 130, an input/output interface 150, a display160, and a communication interface 170. The electronic device 101 mayomit at least one of the above-described elements or may further includeother element(s).

The bus 110 interconnects the above-described elements 110 to 170 andmay include a circuit for conveying communications (e.g., a controlmessage and/or data) among the above-described elements.

The processor 120 may include one or more of a CPU, an AP, or acommunication processor (CP). The processor 120 may perform anarithmetic operation or data processing associated with control and/orcommunication of at least one other element of the electronic device101.

The memory 130 may include a volatile and/or nonvolatile memory. Thememory 130 may store instructions or data associated with at least oneother element of the electronic device 101. The memory 130 may storesoftware and/or a program 140. The program 140 may include a kernel 141,a middleware 143, an application programming interface (API) 145, and/orat least one application 147. At least a part of the kernel 141, themiddleware 143, or the API 145 may be referred to as an operating system(OS).

The kernel 141 controls or manages system resources (e.g., the bus 110,the processor 120, the memory 130, etc.) that are used to executeoperations or functions of other programs (e.g., the middleware 143, theAPI 145, and the application 147). Furthermore, the kernel 141 mayprovide an interface that allows the middleware 143, the API 145, or theapplication 147 to access discrete elements of the electronic device 101so as to control or manage system resources.

The middleware 143 may serve as an intermediary such that the API 145 orthe application 147 communicates with the kernel 141 to exchange data.

Furthermore, the middleware 143 may process one or more task requestsreceived from the application 147 according to a priority order. Forexample, the middleware 143 may assign a priority for using the systemresources (e.g., the bus 110, the processor 120, the memory 130, etc.)of the electronic device 101 to at least one application 147. Themiddleware 143 may process the one or more task requests according tothe priority assigned to the at least one application 147, therebyperforming scheduling or load balancing on the one or more taskrequests.

The API 145 is an interface through which the application 147 controls afunction provided by the kernel 141 or the middleware 143, and mayinclude at least one interface or function (e.g., an instruction) forfile control, window control, image processing, character control, orthe like.

The input/output interface 150 may serve as an interface which transmitsan instruction or data input from a user or an external device to otherelements of the electronic device 101. Furthermore, the input/outputinterface 150 may output an instruction or data, received from otherelements of the electronic device 101, to a user or an external device.

The display 160 may include a liquid crystal display (LCD), alight-emitting diode (LED) display, an organic LED (OLED) display, amicroelectromechanical systems (MEMS) display, or an electronic paperdisplay. The display 160 may display various contents (e.g., a text, animage, a video, an icon, a symbol, and the like) to a user. The display160 may include a touch screen and may receive a touch, gesture,proximity, or hovering input using an electronic pen or a part of auser's body.

The communication interface 170 may establish communication between theelectronic device 101 and a first external electronic device 102, asecond external electronic device 104, or a server 106. Thecommunication interface 170 may be connected to the first externalelectronic device 102 through short-range communication 164 and may beconnected to the second external electronic device 104 and the server106 through a network 162 over wireless communication or wiredcommunication to communicate with the external device.

The wireless communication may include cellular communication employingat least one of long-term evolution (LTE), LTE Advanced (LTE-A), codedivision multiple access (CDMA), wideband CDMA (WCDMA), universal mobiletelecommunications system (UMTS), wireless broadband (WiBro), globalsystem for mobile communications (GSM), or the like, as cellularcommunication protocol. The wireless communication may include theshort-range communication 164. The short-range communication 164 mayinclude at least one of Wi-Fi, Bluetooth (BT), Bluetooth low energy(BLE), Zigbee, near field communication (NFC), magnetic stripetransmission (MST), radio frequency (RF), a body area network (BAN), andGNSS.

The MST may generate a pulse in response to transmission of data usingan electromagnetic signal, and the pulse may generate a magnetic fieldsignal. The electronic device 101 may transfer the magnetic field signalto a POS device, and the POS device may detect the magnetic field signalusing an MST reader. The POS device may recover the data by convertingthe detected magnetic field signal to an electrical signal.

The GNSS may include at least one of a global positioning system (GPS),a global navigation satellite system (Glonass), a Beidou navigationsatellite system (Beidou), or Galileo, a European global satellite-basednavigation system based on an available region, a bandwidth, or thelike. Hereinafter, the terms “GPS” and “GNSS” may be interchangeablyused.

The wired communication may include at least one of a universal serialbus (USB), a high definition multimedia interface (HDMI), a recommendedstandard-232 (RS-232), a plain old telephone service (POTS), or thelike.

The network 162 may include at least one of telecommunications networksa computer network (e.g., local area network (LAN) or a wide areanetwork (WAN)), the Internet, or a telephone network.

Each of the first and second external electronic devices 102 and 104 maybe a device of which the type is different from or the same as that ofthe electronic device 101. The server 106 may include a group of one ormore servers. All or a part of operations performed in the electronicdevice 101 may be executed by one or more external electronic devices(e.g., the first and second external electronic devices 102 and 104 orthe server 106). In the case where the electronic device 101 executesany function or service automatically or in response to a request, theelectronic device 101 may not perform the function or the serviceinternally, but alternatively or additionally, may request at least apart of the function from another device (e.g., the first or secondexternal electronic device 102 or 104 or the server 106). The otherelectronic device may execute the requested function or additionalfunction and may transmit the execution result to the electronic device101. The electronic device 101 may provide the requested function orservice using the received result or may additionally process thereceived result to provide the requested function or service. To thisend cloud computing, distributed computing, or client-server computingmay be used.

FIG. 2 is a block diagram of a configuration of an electronic device,according to an embodiment of the present disclosure.

Referring to FIG. 2, an electronic device 201 is provided. Theelectronic device 201 includes at least one processor 210, acommunication module 220, a subscriber identification module (SIM) 229,a memory 230, a security module 236, a sensor module 240, an inputdevice 250, a display 260, an interface 270, an audio module 280, acamera module 291, a power management module 295, a battery 296, anindicator 297, and a motor 298.

The processor 210 may operate an OS or an application to control aplurality of hardware or software elements connected to the processor210 and may process and compute a variety of data. The processor 210 maybe implemented with a system on chip (SoC). The processor 210 mayfurther include a graphic processing unit (GPU) and/or an image signalprocessor (ISP). The processor 210 may include at least a part (e.g., acellular module 221) of the elements of the electronic device 201. Theprocessor 210 may load an instruction or data, which is received from atleast one of the other elements (e.g., a nonvolatile memory), into avolatile memory and process the loaded instruction or data. Theprocessor 210 may store a variety of data in the nonvolatile memory.

The communication module 220 may include the cellular module 221, aWi-Fi module 222, a BT module 223, a GNSS module 224 (e.g., a GPSmodule, a Glonass module, a Beidou module, or a Galileo module), an NFCmodule 225, an MST module 226, and an RF module 227.

The cellular module 221 may provide voice communication, videocommunication, a text message service, an Internet service, or the likeover a communication network. The cellular module 221 may performidentification and authentication of the electronic device 201 within acommunication network by using the SIM 229. The cellular module 221 mayperform at least a part of functions that the processor 210 provides.The cellular module 221 may include a CP.

Each of the Wi-Fi module 222, the BT module 223, the GNSS module 224,the NFC module 225, and the MST module 226 may include a processor forprocessing data exchanged through the module. At least a part of thecommunication module 220, such as the cellular module 221, the Wi-Fimodule 222, the BT module 223, the GNSS module 224, the NFC module 225,or the MST module 226, may be included within one integrated circuit(IC) or an IC package.

The RF module 227 may transmit and receive a communication signal (e.g.,an RF signal). The RF module 227 may include a transceiver, a poweramplifier module (PAM), a frequency filter, a low noise amplifier (LNA),an antenna, or the like. Alternatively or additionally, at least one ofthe cellular module 221, the Wi-Fi module 222, the BT module 223, theGNSS module 224, the NFC module 225, or the MST module 226 may transmitand receive an RF signal through a separate RF module.

The SIM 229 may include a card containing the SIM and/or embedded SIMand may include unique identification information (e.g., an integratedcircuit card identifier (ICCID)) or subscriber information (e.g.,international mobile subscriber identity (IMSI)).

The memory 230 may include an internal memory 232 and/or an externalmemory 234.

The internal memory 232 may include at least one of a volatile memory(e.g., a dynamic random access memory (DRAM), a static RAM (SRAM), asynchronous DRAM (SDRAM), or the like), a nonvolatile memory (e.g., aone-time programmable read only memory (OTPROM), a programmable ROM(PROM), an erasable and programmable ROM (EPROM), an electricallyerasable and programmable ROM (EEPROM), a mask ROM, a flash ROM, a flashmemory (e.g., a NAND flash memory or a NOR flash memory), or the like),a hard drive, or a solid state drive (SSD).

The external memory 234 may include a flash drive such as compact flash(CF), secure digital (SD), micro secure digital (Micro-SD), mini securedigital (Mini-SD), extreme digital (xD), a multimedia card (MMC), amemory stick, or the like. The external memory 234 may be operativelyand/or physically connected to the electronic device 201 through variousinterfaces.

A security module 236 is a module that includes a storage space of whicha security level is higher than that of the memory 230 and may be acircuit that guarantees safe data storage and a protected executionenvironment. The security module 236 may be implemented with a separatecircuit and may include a separate processor. The security module 236may be in a smart chip or an SD card, which is removable, or may includean embedded secure element (eSE) embedded in a fixed chip of theelectronic device 201. Furthermore, the security module 236 may operatebased on an OS that is different from the OS of the electronic device201. For example, the security module 236 may operate based on java cardopen platform (JCOP) OS.

The sensor module 240 may measure a physical quantity or may detect anoperational state of the electronic device 201. The sensor module 240may convert the measured or detected information to an electricalsignal. The sensor module 240 may include at least one of a gesturesensor 240A, a gyro sensor 240B, a barometric pressure sensor 240C, amagnetic sensor 240D, an acceleration sensor 240E, a grip sensor 240F, aproximity sensor 240G, a red, green, blue (RGB) sensor 240H, a biometricsensor 2401, a temperature/humidity sensor 240J, an illumination sensor240K, or an ultraviolet (UV) sensor 240M. Additionally or alternatively,the sensor module 240 may further include an E-nose sensor, anelectromyography (EMG) sensor, an electroencephalogram (EEG) sensor, anelectrocardiogram (ECG) sensor, an infrared (IR) sensor, an iris sensor,and/or a fingerprint sensor. The sensor module 240 may further include acontrol circuit for controlling at least one or more of the sensorsincluded therein. The electronic device 201 may further include aprocessor that is a part of the processor 210 or independent of theprocessor 210 and is configured to control the sensor module 240. Theprocessor may control the sensor module 240 while the processor 210remains at a sleep state.

The input device 250 includes a touch panel 252, a (digital) pen sensor254, a key 256, and/or an ultrasonic input unit 258. The touch panel 252may use at least one of capacitive, resistive, infrared, and ultrasonicdetecting methods. Also, the touch panel 252 may further include acontrol circuit. The touch panel 252 may further include a tactile layerto provide a tactile reaction to a user.

The (digital) pen sensor 254 may be a part of a touch panel or mayinclude an additional sheet for recognition.

The key 256 may include a physical button, an optical key, or a keypad.

The ultrasonic input device 258 may detect (or sense) an ultrasonicsignal, which is generated from an input device, through a microphone288 and may identify data corresponding to the detected ultrasonicsignal.

The display 260 may include a panel 262, a hologram device 264, and/or aprojector 266.

The panel 262 may be implemented to be flexible, transparent, and/orwearable. The panel 262 and the touch panel 252 may be integrated into asingle module. The panel 262 may include a pressure sensor (or forcesensor) that measures the intensity of touch pressure by a user. Thepressure sensor may be implemented integrally with the touch panel 252,or may be implemented as at least one sensor, separately from the touchpanel 252.

The hologram device 264 may display a stereoscopic image in the airusing an interference of light.

The projector 266 may project light onto a screen to display an image.The screen may be arranged on the inside or the outside of theelectronic device 201.

The display 260 may further include a control circuit for controllingthe panel 262, the hologram device 264, or the projector 266.

The interface 270 may include a high-definition multimedia interface(HDMI) 272, a universal serial bus (USB) 274, an optical interface 276,or a D-subminiature (D-sub) 278. Additionally or generally, theinterface 270 may include a mobile high definition link (MHL) interface,an SD card/MMC interface, or an infrared data association (IrDA)standard interface.

The audio module 280 may convert a sound into an electrical signal andvice versa. The audio module 280 may process sound information that isinput or output through a speaker 282, a receiver 284, an earphone 286,or the microphone 288.

The camera module 291 may capture a still image or a video. The cameramodule 291 may include at least one or more image sensors (e.g., a frontsensor or a rear sensor), a lens, an ISP, or a flash (e.g., an LED or axenon lamp).

The power management module 295 may manage power of the electronicdevice 201. A power management integrated circuit (PMIC), a charger IC,or a battery gauge may be included in the power management module 295.The PMIC may use a wired charging method and/or a wireless chargingmethod. The wireless charging method may include a magnetic resonancemethod, a magnetic induction method, or an electromagnetic method andmay further include an additional circuit, for example, a coil loop, aresonant circuit, a rectifier, or the like. The battery gauge maymeasure a remaining capacity, a voltage, current, or temperature of thebattery 296.

The battery 296 may include a rechargeable battery and/or a solarbattery.

The indicator 297 may display a specific state of the electronic device201 or a part of the electronic device 201(e.g., the processor 210),such as a booting state, a message state, a charging state, and thelike.

The motor 298 may convert an electrical signal into a mechanicalvibration and may generate a vibration or haptic effect, and the like.

A processing device (e.g., a GPU) for supporting a mobile TV may beincluded in the electronic device 201. The processing device forsupporting the mobile TV may process media data according to thestandards of digital multimedia broadcasting (DMB), digital videobroadcasting (DVB), MediaFlo™, or the like.

Each of the above-mentioned elements of the electronic device 201 may beconfigured with one or more components, and the names of the elementsmay be changed according to the type of the electronic device. Theelectronic device 201 may include at least one of the above-mentionedelements, and some elements may be omitted or other additional elementsmay be added. Furthermore, some of the elements of the electronic device201 may be combined with each other so as to form one entity, so thatthe functions of the elements may be performed in the same manner asbefore the combination.

FIG. 3 illustrates a front view of an electronic device, according to anembodiment of the present disclosure.

Referring to FIG. 3, an electronic device 300 is provided. Theelectronic device 300 includes a display 310 and a housing 320. Thedisplay 310 may occupy most parts of a front surface of the electronicdevice 300. A part of the housing 320, which forms a side surface of theelectronic device 300 may be exposed through the front surface of theelectronic device 300.

The electronic device 300 may display a guide image 315, whichrepresents a home button, on the display 310, in response to a specifiedevent (e.g., a touch, press against a physical button, motion detectionby a gyro sensor/acceleration sensor, or the like) or in an always-onmanner Hardware modules (e.g., a biometric sensor, a pressure sensor,and the like) may be disposed at an inner part of the electronic device300 corresponding to the guide image 315.

FIG. 4 illustrates an exploded perspective view of an electronic device,according to an embodiment of the present disclosure.

Referring to FIG. 4, an electronic device 401 is provided. Theelectronic device 401 may include a cover glass 410, a display device420, a bracket 430, a circuit board 440, a rear housing 450, a battery460, and/or a back cover 470. The electronic device 401 may omit one ormore of the elements illustrated in FIG. 4, and may additionally includeone or more elements which are not illustrated in FIG. 4.

The cover glass 410 may transmit light generated by the display device420 when the light passes through the cover glass 410. In addition, auser may make a touch contact with a top of the cover glass 410 throughan electronic pen or a part of the user's body (e.g., a finger). Thecover glass 410 may be formed of, for example, tempered glass,reinforced plastic, a flexible polymer material, or the like and mayprotect the display device 420 or each element included in theelectronic device 401 from an external impact. The cover glass 410 maybe also referred to as a “glass window”.

The display device 420 may be disposed below the cover glass 410 or maybe coupled to the cover glass 410. Accordingly, the display device 420may be exposed through at least a part of the cover glass 410. Thedisplay device 420 may output content (e.g., a text, an image, a video,an icon, a widget, a symbol, or the like) or may receive a touch input(including a touch, a gesture, and a hovering) from a user.

The display device 420 may include a display area 421 and a connectingarea 422 extended from one side (lower side) of the display area 421.Pixels (e.g., OLEDs) may be disposed in the display area 421. Theconnecting area 422 may be electrically connected with an FPCB 425disposed on a rear surface of the display device 420 through variousconductive patterns (i.e., wirings). A side where the connecting area422 starts to be extended, is not limited to the lower side of thedisplay area 421. The connecting area 422 may, alternatively, beextended from an upper side, a left side, and a right side of thedisplay area 421.

A part of the connecting area 422 may be folded toward the rear surfaceof the display area 421 such that the rear surface of the FPCB 425 isapart from the rear surface of the display area 421 to face the displayarea 421. The conductive pattern, which is formed in a partial area 427of the FPCB 425, may pass a side surface of the bracket 430 and may beelectrically connected with a main circuit board 440m of the circuitboard 440 through a specified connector. Similarly to the display area421, pixels may be arranged in the connecting area 422 depending on thedesign of the electronic device 401.

The display device 420 may include an LCD panel, an LED display panel,an OLED display panel, an MEMS display panel, or an electronic paperdisplay panel. The display device 420 may include a capacitive touchpanel, a pressure sensitive touch panel, a resistive touch panel, aninfrared touch panel, or an ultrasonic touch panel. The touch panel maybe inserted into a display panel (e.g., an add-on touch panel), may bedirectly formed on the display panel (e.g., an on-cell touch panel), ormay be included in the display panel (e.g., an in-cell touch panel).

The bracket 430, which may be formed of a magnesium (Mg) alloy, may bedisposed below the display device 420 and above the circuit board 440.The bracket 430 may be coupled to the display device 420 and the circuitboard 440 to physically support the display device 420 and the circuitboard 440. A swelling gap may be formed in the bracket 430 inconsideration of swelling of the battery 460 which may occur due todeterioration of the battery 460.

The circuit board 440 may include the main circuit board 440m or asub-circuit board 440s. The main circuit board 440m and the sub-circuitboard 440s may be disposed below the bracket 430 and may be electricallyconnected with each other through a specified connector or a specifiedwiring. The main circuit board 440m and the sub-circuit board 440s maybe implemented with rigid printed circuit boards (PCBs). Variouselectronic elements, devices, PCBs, or the like (e.g., a processor, amemory, a communication circuit, or the like) may be mounted on the maincircuit board 440m and the sub-circuit board 440s. The main circuitboard 440m and the sub-circuit board 440s may be referred to as a mainboard, a printed board assembly (PBA), or a PCB.

The rear housing 450 may be disposed below the circuit board 440 toreceive elements of the electronic device 401. The rear housing 450 mayform an outer side surface of the electronic device 401. The rearhousing 450 may be referred to as rear case or a rear plate. The rearhousing 450 may include an area not exposed outside of the electronicdevice 401 and an area exposed to an outer side surface of theelectronic device 401. The area not exposed outside of the electronicdevice 401 may include a plastic injection product. The area exposed tothe outer side surface of the electronic device 401 may be formed ofmetal. The area exposed to the outer side surface and formed of metalmay be referred to as a metal bezel. At least a part of the metal bezelmay be utilized as an antenna radiator to transmit and receive a signalhaving a specified frequency.

The battery 460 may convert chemical energy to electrical energy orelectrical energy to chemical energy. The battery 460 may convertchemical energy to electrical energy and may supply the electricalenergy to various elements or modules which are mounted above thedisplay device 420 and the circuit board 440. In addition, the battery460 may convert electrical energy, which is supplied from the outside,to chemical energy and may store the chemical energy therein. Thecircuit board 440 may include a power management module to managecharging/discharging of the battery 460.

The back cover 470 may be coupled to the rear surface of the electronicdevice 401. The back cover 470 may be formed of tempered glass, aplastic injection product, and/or metal. The back cover 470 may beimplemented integrally with the rear housing 450 or may be implementedto be detachable from the rear housing 450 by a user.

FIGS. 5A and 5B illustrate a display device of an electronic device,according to an embodiment of the present disclosure.

Referring to FIG. 5A, a display device 520 is provided. The displaydevice 520 may include a display area 521, a connecting area 522, and anFPCB 525. The display device 520 may be referred to as a display moduleor display assembly. Through the display area 521, various types ofcontent (e.g., an image, a text or the like) may be output or displayed,or an input (e.g., a touch or hovering input) may be received from auser. The connecting area 522 may be extended from one side of thedisplay area 521 and may be folded or bent in a specific direction. TheFPCB 525 may be electrically connected with a conductive pattern formedabove the connecting area 522. A conductive pattern formed in a partialarea 527 of the FPCB 525 may be electrically connected with a maincircuit board through a specified connector.

Referring to FIG. 5B a sectional surface of the display device 520 takenalong auxiliary line x-x′ shown in FIG. 5A is provided. As shown in FIG.5B, a touch screen display panel 521-1, a synthetic film (e.g.,polyimide (PI) film) 521-2, and panel/film layer (e.g., a protectivefilm (PF), a back panel, or the like) 521-3 are stacked in the displayarea 521 of the display device 520. The display panel 521-1 may bedisposed on a front surface (first-directional front surface), whichfaces a first direction, of the synthetic film 521-2 and the panel/filmlayer 521-3 may be disposed on a rear surface (a second-directional rearsurface), which faces a second direction, of the synthetic film 521-2.

Various layers included in the display area 521 may be totally orpartially stacked above the connecting area 522 of the display device520. The connecting area 522 may include the synthetic film 521-2extended from one side of the display area 521. A hardware module 531(e.g., a display driver integrated circuit (DDI)) may be disposed on thefirst-directional front surface of the synthetic film 521-2.

An FPCB 525 may include various conductive patterns formed on afirst-directional front surface thereof and/or on a second-directionalrear surface thereof. The conductive pattern formed on the front surfaceand/or the rear surface of the FPCB 525 may be electrically connectedwith a conductive pattern formed above the connecting area 522. Ahardware module (e.g., a biometric sensor or a pressure sensor) 532,which performs a specified function, may be mounted on thesecond-directional rear surface of the FPCB 525.

A part of the connecting area 522 may be folded toward thesecond-directional rear surface of the display area 521 such that thesecond-directional rear surface of the FPCB 525 is apart from thesecond-directional rear surface of the display area 521 to face thesecond-directional rear surface of the display area 521 facing thesecond direction. Accordingly, the module 532 disposed on the rearsurface of the FPCB 525 may be disposed below the display area 521.

FIGS. 6A and 6B illustrate mounting structures for hardware modules inan electronic device, according to an embodiment of the presentdisclosure.

Referring to FIG. 6A, an electronic device 600 a is provided. Theelectronic device 600 a may include a display 610, an FPCB 620, a backpanel 630, a first (hardware) module 640, a buffer member 645, anadhesive layer 653, a pressure sensor 655, a second (hardware) module650, and a third (hardware) module 660. The display 610 and the FPCB 620may constitute a display device 601. The electronic device 600 a mayomit one or more of the elements illustrated in FIG. 6A, and mayadditionally include one or more elements which are not illustrated inFIG. 6A.

The display 610 may include a display area 611 and a connecting area 612extended from one side of the display area 611. A bent area 612-1 of theconnecting area 612 may be folded toward the rear surface of the displayarea 611 such that a rear surface of the FPCB 620 is apart from thedisplay area 611 to face the display area 611.

The display area 611 of the display 610 may include a plurality oflayers. The layers may include at least one of an adhesive layer, apolarization layer, a display panel and a synthetic film (e.g., PI film)Various contents may be output through a plurality of pixels, which areincluded in the display panel, in the display area 611.

The connecting area 612 of the display 610 may be folded, such that thefirst module 640 above the FPCB 620 is apart from the display 610, toface the display 610. As the connecting area 612 is bent, at least apart of the connecting area 612 may have specific curvatures.

The connecting area 612 may include at least one of layers included inthe display area 611. The connecting area 612 may include at least asynthetic film. The connecting area 612 may be formed of a PI. Pixelsmay not be formed in the connecting area 612. Alternatively, theconnecting area 612 may include a plurality of pixels to constitute apart of the display panel.

The bent area 612-1 of the connecting area 612 may further include abending protect layer (BPL) to prevent a bent portion from being broken.The third module 660 (e.g., DDI) may be mounted on one surface (e.g., afront surface or rear surface) of a planar area 612-2 of the connectingarea 612.

The FPCB 620 may be electrically connected with the connecting area 612of the display 610. The first module 640 (e.g., a biometric sensor or apressure sensor), may be disposed on the rear surface (i.e., a firstsurface—a surface facing the display area 611 of the display 610) of theFPCB 620. In addition, the second module 650 may be disposed on a frontsurface (i.e., second surface—a surface opposite to the first surface)of the FPCB 620. The second module 650 (e.g., a biometric sensor IC, apressure sensor IC, or the like) may be associated with a function ofthe first module 640.

The back panel (or C-panel) 630 may be formed under the display area 611of the display 610, i.e., on a rear surface of the display 610. The backpanel 630 may include at least one of a light shielding layer (EMBOlayer), which is to shield light emitted from the display 610, a bufferlayer (e.g., a sponge layer), which is to reduce impact applied onto thedisplay 610 by a user input, a metallic layer (e.g., copper (Cu) or agraphite layer), and an electronic pen sensor layer. An opening may beformed in an area, which corresponds to the first module 640, of theback panel 630, i.e., above the first module 640.

The first module 640 may include various hardware modules which aredisposed below the display 610. The first module 640 may include abiometric sensor (e.g., a fingerprint sensor) and/or a pressure sensor.For example, when the first module 640 includes a biometric sensor and apressure sensor, at least one pressure sensor may be disposed adjacentto the biometric sensor and may be disposed on the rear surface of theFPCB 620 (i.e., a first surface) (see FIGS. 9 and 10). In this case ifthe pressure sensor detects pressure having a specified value or more,the biometric sensor may be activated (see FIGS. 12 and 13).

The buffer member 645 may be disposed on a surface, which faces thedisplay 610, of the first module 640. The buffer member 645 may preventthe display 610 from pressing the first module 640 as the display 610 isbent by a physical (i.e., a touch) input from a user. The buffer member645 may be formed of a urethane foam (e.g., Poron™).

The adhesive layer 653 may include a water-proof member to pass airwhile blocking moisture. An area, which surrounds the opening of theback panel 630, may be attached to the FPCB 620 through the adhesivelayer 653. Accordingly, the first module 640 may be sealed by thedisplay 610, an inner surface of the opening formed in the back panel630, the adhesive layer 653, and the FPCB 620.

The pressure sensor 655 may be interposed between the back panel 630 andthe FPCB 620 though the adhesive layer 653. Accordingly, when a physicalinput is received onto the display 610 from the user, the pressuresensor 655 may detect the pressure of the physical input.

Referring to FIG. 6B, an electronic device 600 b is provided. Theelectronic device 600 b may include the display 610, the FPCB 620, theback panel 630, the pressure sensor 655, the second (hardware) module650, and the third (hardware module) 660. The display 610 and the FPCB620 may constitute the display device 601. In the following descriptionof FIG. 6B, the details of the same elements assigned with the samereference numerals as those of FIG. 6A may be omitted.

The back panel 630 of the electronic device 600 b illustrated in FIG. 6Bmay have no opening, which is different from the back panel 630 of theelectronic device 600 a illustrated in FIG. 6A. An element, such as thefirst module 640 of FIG. 6A, may be omitted below the back panel 630 inthe electronic device illustrated in FIG. 6B. The adhesive layers 653and the pressure senor 655 may be disposed below the back panel 630.

The pressure sensor 655 may be disposed between the back panel 630 andthe FPCB 620 though the adhesive layers 653. Accordingly, when aphysical input is received onto the display 610 from the user, thepressure sensor 655 may detect the pressure of the physical input.

The electronic device 600 b may perform a specific function (the controlof functions and operations of elements included in the electronicdevice 600 b) if the pressure sensor 655 detects pressure having aspecified value or more.

For example, if a specified value or more is detected by the pressuresensor 655 while the electronic device 600 b is operating in a sleepmode (meaning a mode of turning off the display 610 and waiting for theinput from a user in a low-power state), the electronic device 600 b mayactivate the display 610 and may output a home screen or a lock screento the display 610. The electronic device 600 b may output a userinterface (UI), which is based on the intensity of the pressure detectedby the pressure sensor 655, to the display 610.

FIGS. 7A and 7B illustrate mounting structures for hardware modules ofan electronic device, according to an embodiment of the presentdisclosure.

Referring to FIG. 7A, an electronic device 700 a is provided. Theelectronic device 700 a may include a cover glass 710, an optical clearadhesive (OCA) layer 715, a polarization layer 720, a display panel 730,a PI film 735, a protective film 737, a BPL 739, a back panel 740, afingerprint sensor 750 (or other biometric sensor), a buffer member 755,adhesive layers 761 and 765, a pressure sensor 763, an FPCB 770, anadhesive layer 780, a protective film 785, and a DDI 790. The OCA layer715, the polarization layer 720, the display panel 730, the PI film 735,the BPL 739, and the FPCB 770 constitute a display device. In addition,although FIG. 7A illustrates the fingerprint sensor 750 serving as anexample of a biometric sensor, this disclosure is not limited thereto.For example, the fingerprint sensor 750 may be substituted with an irissensor or another biometric sensor.

The cover glass 710 may transmit light generated by the display panel730. In addition, a user may make a touch contact with the top of thecover glass 710 by a finger 7 of a body.

The OCA layer 715 may be a transparent adhesive layer and may allow thecover glass 710 to adhere to the polarization layer 720.

The polarization layer (or polarization film) 720 may prevent externallight from being reflected to improve panel visibility in a brightplace. The polarization layer 720 may include a polyethyleneterephthalate (PET) film or a tri-acetyl cellulose (TAC) film.

The display panel 730 may include a scan line, a data line, a lightemitting device (e.g., OLED), which generates light based on signalssupplied from the scan line and the data line, a substrate (e.g., a lowtemperature poly silicon (LTPS) substrate) above which the lightemitting device is disposed, and a thin film encapsulation (TFE) filmwhich protects the light emitting device.

The PI film 735 (i.e., a flexible member) may be disposed below thedisplay panel 730. The PI film 735 may include a wiring for supplyingpower and/or a signal to the display panel 730. The PI film 735 mayinclude a first area making contact with the display panel 730 and asecond area which does not make contact with the display panel 730.

The second area of the PI film 735 may be folded toward the rear surfaceof the display panel 730. The second area may be divided into a bentarea 735-1 and a planar area 735-2. Due to the bent area 735-1, theplanar layer 735-2 of the PI film 735 may face the display panel 730,and the fingerprint sensor 750 may be apart from the display panel 730to face the display panel 730.

The PI film 735 may be disposed above the display panel 730 or may beincluded as an element in the display panel 730.

The protective film 737 may be disposed below the PI film 735 to supportthe PI film 735.

The BPL 739 may be attached to the bent area 735-1 and/or at least apart of the planar area 735-2 of the PI film 735. The BPL 739 mayprevent the bent area 735-1 from being broken.

The back panel 740 may be formed below the protective film 737 on a rearsurface of the display panel 730. The back panel 740 may include atleast one of a light shielding layer (e.g., an EMBO layer) 741, a bufferlayer (e.g., a sponge layer) 743, and a metallic layer (e.g., a copper(Cu) and graphite layer) 745.

An opening W_(opening) may be formed in an area, which corresponds tothe biometric sensor 750, of the back panel 740, that is, above thefingerprint sensor 750. Due to the opening W_(opening), the fingerprintformed in the finger 7 of the user may be recognized by the fingerprintsensor 750. The light generated from the display panel 730 may bereflected from the fingerprint of the finger 7, and the reflected lightmay reach the fingerprint sensor 750 through the cover glass 710, theOCA layer 715, the polarization layer 720, the display panel 730, the PIfilm 735, the protective film 737, and the opening W_(opening). In otherwords, the fingerprint sensor 750 may be configured to use at least oneof a plurality of pixels, which are included in the display panel 730,as a light source for fingerprint recognition.

The fingerprint image of the finger 7 may be captured by the fingerprintsensor 750. The fingerprint sensor 750 may correspond to an opticalfingerprint sensor. The fingerprint sensor 750 may capture a fingerprintimage using an image sensor (e.g., a complementary metal oxidesemiconductor (CMOS) or a charge-coupled device (CCD)) embedded therein.The fingerprint sensor 750 may extract unique fingerprint minutiae fromthe fingerprint image. The fingerprint minutiae may include, forexample, a ridge ending, a crossover, a bifurcation, a pore, and thelike, included in the fingerprint. The fingerprint minutiae may becompared with fingerprint minutiae registered in advance, such that thefingerprint minutiae are used for user authentication.

The buffer member 755 may be disposed on the surface of the fingerprintsensor 750. The buffer member 755 may prevent the protective film 737from pressing the fingerprint sensor 750 due to a physical input fromthe finger 7 of the user. The buffer member 755 may be formed of aurethane foam (e.g., Poron™).

The adhesive layers 761 and 765 may include a member through which airmay pass while blocking moisture. The pressure senor 763 may be disposedbetween the adhesive layers 761 and 765. The pressure sensor 763 maydetect pressure applied by the finger 7 of the user and transmittedthrough the cover glass 710, the OCA layer 715, the polarization layer720, the display panel 730, the PI film 735, the protective film 737,the back panel 740, and the adhesive layer 761.

An area that surrounds the opening W_(opening) of the back panel 740 maybe attached to the FPCB 770 through the adhesive layer 761, the pressuresensor 763, and the adhesive layer 765. Accordingly, the fingerprintsensor 750 may be sealed by the protective film 737, an inner surface ofthe opening formed in the back panel 740, the adhesive layer 761, thepressure sensor 763, the adhesive layer 765, and the FPCB 770.

The FPCB 770 may be electrically connected with the planar area 735-2 ofthe PI-film 735. The FPCB 770 may be electrically connected with theconductive pattern formed in the PI-film 735. The fingerprint sensor 750may be disposed on one surface of the FPCB 770. A driver IC of thefingerprint sensor 750 may be disposed on another surface of the FPCB770.

The adhesive layer 780 and the protective film 785 may be attachedbetween the back panel 740 and the PI film 735 to physically support thecover glass 710, the OCA layer 715, the polarization layer 720, thedisplay panel 730, the PI film 735, and the protective film 737.

The DDI 790 may control the display panel 730. The DDI 790 may supplythe display panel 730 with an image signal corresponding to image datareceived from the processor (i.e., a host) at a preset frame rate. TheDDI 790 may be disposed on one surface of the planar area 735-2 of thePI film 735.

Referring to FIG. 7B, an electronic device 700 b is provided. Theelectronic device 700 b may include elements which are the same as orsimilar to those of the electronic device 700 a illustrated in FIG. 7A.In the following description of FIG. 7B, the details of the sameelements assigned with the same reference numerals as those of FIG. 7Amay be omitted in order to avoid redundancy.

The back panel 740 may further include an electronic pen sensor layer744 in addition to the light shielding layer 741, the buffer layer 743,and the metallic layer 745. The electronic pen sensor layer 744 may beused to sense a contact state and a contact position by an electronicpen (e.g., a position indicator, a stylus, a digitizer pen, or thelike). The electronic pen sensor layer 744 may be referred to aselectronic pen sensor sheet or a digitizer.

FIG. 7B illustrates the electronic pen sensor layer 744 interposedbetween the buffer layer 743 and the metallic layer 745, but thisdisclosure is not limited thereto. The electronic pen sensor layer 744may be interposed between the light shielding layer 741 and the bufferlayer 743, and may be interposed between the light shielding layer 741and the protective film 737.

FIGS. 8A and 8B illustrate mounting structures for hardware modules ofan electronic device, according to an embodiment of the presentdisclosure.

Referring to FIG. 8A, an electronic device 800 a is provided. Theelectronic device 800 a may include a cover glass 810, an OCA layer 815,a polarization layer 820, a display panel 830, a PI film 835, aprotective film 837, a back panel 840, a fingerprint sensor 850, abuffer member 855, adhesive layers 861 and 865, a pressure sensor 863,an FPCB 870, an adhesive layer 880, a protective film 885, and a DDI890. The OCA layer 815, the polarization layer 820, the display panel830, the PI film 835, the BPL 739, and the FPCB 870 constitute a displaydevice. In addition, although FIG. 8A illustrates the fingerprint sensor850 serving as an example of a biometric sensor, this disclosure is notlimited thereto. For example, the fingerprint sensor 850 may besubstituted with an iris sensor or another biometric sensor. In thefollowing description of FIG. 8A, the details of the same elementsassigned with the similar reference numerals as those of FIG. 7A may beomitted.

The FPCB 870 may be electronically connected with the display panel 830.The FPCB 870 may be electrically connected with the display panel 830through a hot bar or soldering.

The FPCB 870 may include a bent area 870-1 and a planar area 870-2connected with the bent area 870-1. The bent area 870-1 may be connectedwith the display panel 830 and may be folded toward a rear surface ofthe display panel 830. In FIG. 8A, the FPCB 870 may be folded, which isdifferent from the FPCB 770 of FIG. 7A.

The rear surface of the planar area 870-2 of the FPCB 870 may be apartfrom a rear surface of the display panel 830 to face the rear surface ofthe display panel 830 due to the bent area 870-1 of the FPCB 870.Accordingly, the fingerprint sensor 850 and the pressure sensor 863 maybe apart from the display panel 830 to face the display panel 830.

The fingerprint sensor 850 and at least one pressure sensor 863 adjacentto the fingerprint sensor 850 may be disposed on the rear surface (i.e.,a first surface—a surface facing the display panel 830) of the planararea 870-2 of the FPCB 870. The pressure sensor 863 may be attached tothe rear surface of the planar area 870-2 of the FPCB 870 through theadhesive layer 865. The DDI 890 may be disposed on the front surface(i.e., a second surface—an opposite surface to a surface having theprotective film 885 attached thereto) of the planar area 870-2 of theFPCB 870.

Referring to FIG. 8B an electronic device 800 b is provided. Theelectronic device 800 b illustrated in FIG. 8B may include elements thesame as or similar to those of the electronic device 800 a illustratedin FIG. 8A. In the following description of FIG. 8B, the details of thesame elements assigned with the same reference numerals as those of FIG.8A may be omitted in order to avoid redundancy.

The back panel 840 may further include an electronic pen sensor layer844 in addition to a light shielding layer 841, a buffer layer 843, anda metallic layer 845. The electronic pen sensor layer 844 may be used todetect a contact state by an electronic pen and a contact position ofthe electronic pen. FIG. 8B illustrates the electronic pen sensor layer844 interposed between the buffer layer 843 and the metallic layer 845,but this disclosure is not limited thereto. The electronic pen sensorlayer 844 may be interposed between the light shielding layer 841 andthe buffer layer 843, and may be interposed between the light shieldinglayer 841 and the protective film 837.

FIG. 9 illustrates a mounting structure for a biometric sensor and apressure sensor, according to an embodiment of the present disclosure.

Referring to FIG. 9, a pressure sensor 920 a may be disposed to surrounda biometric sensor (e.g., a fingerprint sensor) 910 a. The pressuresensor 920 a may include a first electrode 921 a, a second electrode 925a, and a dielectric layer 923 a. The pressure sensor 920 a may sense thepressure of the touch based on capacitance between the first electrode921 a and the second electrode 925 a, which varies by the touch.

The first electrode 921 a and/or the second electrode 925 a may beimplemented to be transparent or opaque. For example, if implemented tobe opaque, the first electrode 921 a and/or the second electrode 925 amay include copper (Cu), silver (Ag), magnesium (Mg), titanium (Ti), oropaque graphene. In addition, if the first electrode 921a and/or thesecond electrode 925 a is implemented to be transparent, the firstelectrode 921 a and/or the second electrode 925 a may be formed ofindium thin oxide (ITO), indium zinc oxide (IZO), Ag nanowire, metalmesh, transparent conducting polymer, or transparent graphene.

The dielectric layer 923 a may be implemented with a dielectricsubstance having resilience, for example, a silicone foam, siliconemembrane, sponge, rubber, polycabondate (PC), or polyethyleneterephthalate (PET).

Alternatively, a pressure sensor 920 b may be disposed to surround abiometric sensor 910 b and may be divided into a plurality of pressuresensors (e.g., four pressure sensors). In this case, the pressure sensor920 b may detect the position distribution of applied pressure as wellas the intensity of the pressure.

FIG. 10 illustrates mounting structures for biometric sensors andpressure sensors, according to an embodiment of the present disclosure.

Referring to FIG. 10, electronic devices 1001, 1002, 1003, 1004, and1005 are provided. Referring to electronic device 1001, a pressuresensor 1012 may be disposed to surround a biometric sensor (e.g., afingerprint sensor) 1011. The biometric sensor 1011 may have arectangular shape in which a width side is longer than a length side.The pressure sensor 1012 may include a single first electrode, a singlesecond electrode, and a dielectric layer (see FIG. 9).

Referring to electronic device 1002, a pressure sensor 1022 may bedisposed to surround a biometric sensor (e.g., a fingerprint sensor)1021. The biometric sensor 1021 may have a rectangular shape in which alength side is longer than a width side.

Referring to electronic device 1003, two pressure sensors 1032-1 and1032-2 may be disposed adjacent to an upper width side and a lower widthside, respectively, of a biometric sensor (e.g., fingerprint sensor)1031.

Referring to electronic device 1004, two pressure sensors 1042-1 and1042-2 may be disposed adjacent to a left length side and a right lengthside, respectively, of a biometric sensor (e.g., fingerprint sensor)1041.

Referring to electronic device 1005 four pressure sensors 1052-1,1052-2, 1052-3, and 1052-4 may be disposed adjacent to each of foursides, respectively, of a biometric sensor (e.g., fingerprint sensor)1051. For example, a finger 10-5 a of a user may touch with a specifiedpressure, i.e., a force touch, around an upper end of the biometricsensor 1051. In this case, the electronic device 1005 may recognize theforce touch made by the finger 10-5 a through the upper pressure sensor1052-1 and the right pressure sensor 1052-2 disposed at the right side.Alternatively, a finger 10-5 b of a user may make a force touch near alower left end of the biometric sensor (e.g., fingerprint sensor) 1051.In this case, the electronic device 1005 may recognize the force touchmade by the finger 10-5 b through the lower pressure sensor 1052-3 andthe left pressure sensor 1052-4. According to the electronic device1005, the force touch by the finger 10-5 a and the force touch by thefinger 10-5 b may be recognized as different inputs. Accordingly, afunction corresponding to each input may be provided.

FIGS. 11A and 11B illustrates flexible printed circuit board (FPCB)mounting structures for biometric sensors and pressure sensors,according to an embodiment of the present disclosure;

Referring to FIG. 11A, a biometric sensor (e.g., a fingerprint sensor)1120 a may be disposed on one surface of an FPCB 1110 a. The biometricsensor 1120 a may correspond to the first module 640 illustrated in FIG.6A, the fingerprint sensor 750 illustrated in FIG. 7A, or thefingerprint sensor 850 illustrated in FIG. 8A. The FPCB 1110 a maycorrespond to the FPCB 620 illustrated in FIG. 6A, the FPCB 770illustrated in FIG. 7A, or the FPCB 870 illustrated in FIG. 8A. Arecessed portion 1115 a may be formed in one surface of the FPCB 1110 athrough an etching process. The biometric sensor 1120 a may be seated inthe recessed portion 1115 a.

Referring to FIG. 11B, a biometric sensor (e.g., a fingerprint sensor)1120 b and a plurality of pressure sensors 1130 b may be provided in onesurface of an FPCB 1110 b. The pressure sensors 1130 b may correspond tothe pressure sensor 655 illustrated in FIG. 6A, the pressure sensor 763illustrated in FIG. 7A, or the pressure sensor 863 illustrated in FIG.8A. Adhesive layers (e.g., tapes) may be additionally attached to frontand rear surfaces of the pressure sensors 1130 b. A recessed portion1115 b may be formed in one surface of the FPCB 1110 b. The biometricsensor 1120 b and the pressure sensors 1130 b may be seated in therecessed portion 1115 b formed in the FPCB 1110 b.

The thicknesses of the FPCB 1110 a and 1110 b, having the biometricsensors 1120 a and 1120 b disposed therein, may be reduced due to therecessed portions 1115 a and 1115 b formed in the FPCB 1110 a and 1110b, respectively.

FIG. 12 is a flowchart of a fingerprint verification method, accordingto an embodiment of the present disclosure.

Referring to FIG. 12, a fingerprint verification method is described.The fingerprint verification method may be implemented with instructionsthat are performed (or executed) by a processor of an electronic device.The instructions may be stored in computer recording media orinternal/external memory of the electronic device.

In operation 1201, the electronic device may detect pressure applied toa part (e.g., an area on which the guide image 315 representing a homebutton is displayed as illustrated in FIG. 3) of a display (or a coverglass) by a finger of a user through the pressure sensor. The electronicdevice may detect pressure applied by the finger regardless of theON/OFF states of the display panel of the display.

In operation 1203, the electronic device may activate a fingerprintsensor (or other biometric sensor) if the pressure detected in operation1201 is more than or equal to a specified value. In other words, if theforce touch is received from the user, the fingerprint sensor and afingerprint sensor IC driving the same may be triggered to operate.

In operation 1205, the electronic device may detect the fingerprint(i.e., fingerprint minutiae) of a finger using the fingerprint sensor.For example, in the case that the fingerprint sensor corresponds to anoptical fingerprint sensor, light having specified brightness may beemitted from a part (e.g., an area on which the guide image 315representing a home button is displayed, as illustrated in FIG. 3) ofthe display corresponding to an area for the fingerprint sensor toincrease the accuracy of the fingerprint verification.

In operation 1207, the electronic device may compare the fingerprintdetected in operation 1205, to a fingerprint which is stored in thememory or registered in a server.

In operation 1209, the electronic device may determine whether thefingerprint compared in operation 1207 is matched with the registeredfingerprint. If the detected fingerprint is matched with the registeredfingerprint in operation 1209, the electronic device may perform a firstfunction in operation 1211. For example, if the display is in an OFFstate when operation 1201 is performed, the first function may include afunction of switching the state of the display state to an ON state. Inthis case, the first function may further include a function ofoutputting an unlocked screen onto the display. Alternatively, if thedisplay is in the ON state and a locked screen is output onto thedisplay at the time when operation 1201 is performed, the first functionmay include a function of outputting an unlocked screen to the display.

If the detected fingerprint is not matched with the registeredfingerprint in operation 1209, the electronic device may perform asecond function in operation 1213. For example, the electronic devicemay perform the second function different from the first function. Forexample, if the display is in the OFF state at the time when operation1201 is performed, the second function may include a function ofmaintaining the display in the OFF state. Alternatively, if the displayis in the ON state and a locked screen is output onto the display at thetime when operation 1201 is performed, the second function may include afunction of maintaining the locked screen.

Accordingly, if a touch (i.e., a force touch) having a specified valueor more is detected through the pressure sensor of the electronicdevice, the fingerprint sensor is activated to verify the fingerprint ofthe finger making the touch. Accordingly, the pressure sensor may beactually used as a home button, and the fingerprint of the fingerapplying pressure to the pressure sensor may be instantly verified,thereby improving the convenience of a user.

FIG. 13 illustrates a fingerprint verification method, according to anembodiment of the present disclosure.

Referring to FIG. 13, an electronic device 1301 is provided. A screen1311 including a guide image 1315 representing a home button may beoutput to a display 1310 (i.e., a touch screen) of the electronic device1301. The guide image 1315 may be substantially always output to thedisplay 1310 (i.e., always-on).

For example, a user may make a force touch to an area of the display1310, onto which the guide image 1315 is output. If a force touch 13 ismade on the display 1310, the electronic device 1301 may activate thefingerprint sensor based on the pressure of the force touch 13. Thefingerprint of a finger making the force touch 13 may be detected by theactivated fingerprint sensor. The electronic device 1301 may compare thedetected fingerprint with a registered fingerprint stored in the memory.

For example, if the detected fingerprint is matched with the registeredfingerprint (that is, if the fingerprint verification is successful),the electronic device 1301 may switch the state of the display 1310 tothe ON state, and may output a home screen 1312, which is unlocked, ontothe display 1310 as a first function.

On the other hand, if the detected fingerprint is not matched with theregistered fingerprint (that is, if the fingerprint verification isfailed), the electronic device 1301 may continuously output the existingscreen 1311 as a second function. The electronic device 1301 maytemporarily output a warning notice that the detected fingerprint is notmatched with the registered fingerprint, if the fingerprint verificationis failed.

In general, a fingerprint sensor is disposed above a physical button(e.g., a home button). However, according to an electronic device of thepresent invention, in the mounting structure for the hardware module inthe electronic device, the fingerprint sensor and the pressure sensormay be disposed below the display area of the display. Accordingly, inthe case that the function of the physical button is allocated to thepressure sensor and the fingerprint sensor is disposed adjacent to thepressure sensor, even if the display constitutes the entire frontsurface of the electronic device, an existing function of a home buttonmay be maintained.

According to an embodiment of the present application, an electronicdevice may include a display including a display area and a connectingarea extended from one side of the display area, an FPCB electricallyconnected with the connecting area, and a first module mounted on afirst surface of the FPCB. The connecting area may be bent such that thefirst module is apart from the display to face the display.

The connecting area may include polyimide (PI). Pixels of the displayare not formed in the connecting area.

The connecting area may include a part of a display panel of thedisplay.

At least a part of the connecting area may be bent with a specifiedcurvature.

The electronic device may further include a second module mounted on asecond surface of the FPCB, which is opposite to the first surface.

The second module may be configured to operate in association with afunction of the first module.

The electronic device may further include a back panel formed on a rearsurface of the display, and an opening may be formed in an area of theback panel, which corresponds to the first module.

An area of the back panel, which surrounds the opening, may be attachedto the FPCB through an adhesive layer, and the adhesive layer mayinclude a water-proof member which passes air while blocking moisture.

The display may include a back panel formed on a rear surface thereof.An opening may not be formed in the back panel, and the first module maybe a pressure sensor.

The first module may include a biometric sensor or a pressure sensor.

The biometric sensor may be configured to use at least one of aplurality of pixels, which are included in the display, as a lightsource.

The first module may be a biometric sensor, and at least one pressuresensor may be mounted on the first surface while being adjacent to thefirst module.

The biometric sensor may be configured to be activated if the at leastone pressure sensor detects pressure having a specific value or more.

A buffer member may be disposed on a surface of the first module, whichfaces the display.

The electronic device may further include a display driver integratedcircuit mounted on one surface of the connecting area to control thedisplay.

According to an embodiment, the electronic device may include an FPCBincluding a planar area and a bent area, a sensor mounted on a firstsurface of the planar area, and a display connected with the bent area.The bent area may be bent such that the sensor is apart from the displayto face the display.

The electronic device may further include a back panel formed on a rearsurface of the display. An opening may be formed in an area of the backpanel, which corresponds to the sensor.

The sensor may be configured to use at least one of a plurality ofpixels, which are included in the display, as a light source.

The electronic device may further include a display driver integratedcircuit mounted on one surface of the planar area to operate thedisplay.

According to an embodiment, an electronic device may include a displaypanel having a plurality of pixels to display content, a flexible memberincluding a first area making contact with one surface of the displaypanel and a second area extended from the one surface of the displaypanel, a display driver integrated circuit provided above the secondarea of the flexible member, an FPCB electrically connected with thesecond area, and a biometric sensor mounted on one surface of the FPCB.

The biometric sensor may be configured to use at least one of aplurality of pixels, which are included in the display, as a lightsource.

The second area may be bent such that the biometric sensor is apart fromthe display to face the display.

According to an embodiment, an electronic device may include a displayincluding a display area and a connecting area extended from one side ofthe display area and a flexible printed circuit board (FPCB)electrically connected with the connecting area. A part of theconnection area is folded toward a rear surface of the display area suchthat a rear surface of the FPCB is apart from the rear surface of thedisplay area to face the rear surface of the display area. A firstmodule is mounted on the rear surface of the FPCB.

According to an embodiment, an electronic device may include a displaypanel and an FPCB which includes a bent area electrically connected withthe display panel and a planar area connected with the bent area. Thebent area may be folded toward a rear surface of the display such that arear surface of the planar area is apart from the rear surface of thedisplay panel to face the rear surface of the display panel. A firstmodule may be mounted on the rear surface of the planar area.

The term “module” used in this disclosure may represent a unit includingone or more combinations of hardware, software and firmware. The term“module” may be interchangeably used with the terms “unit”, “logic”,“logical block”, “component” and “circuit”. The “module” may be aminimum unit of an integrated component or may be a part thereof. The“module” may be a minimum unit for performing one or more functions or apart thereof. The “module” may be implemented mechanically orelectronically. The “module” may include at least one of anapplication-specific IC (ASIC) chip, a field-programmable gate array(FPGA), and a programmable-logic device for performing some operations,which are known or will be developed.

At least a part of an apparatus (e.g., modules or functions thereof) ormethods (e.g., operations) of the present disclosure may be implementedby instructions stored in a computer-readable storage media in the formof a program module. The instruction, when executed by the processor120, may cause the processor 120 to perform a function corresponding tothe instruction. The computer-readable storage media may be the memory130.

A computer-readable recording medium may include a hard disk, a floppydisk, a magnetic medium (e.g., a magnetic tape), an optical medium(e.g., a CD-ROM and a DVD), a magneto-optical medium (e.g., a flopticaldisk), and a hardware device (e.g., a read only memory (ROM), a randomaccess memory (RAM), or a flash memory). Also, a program instruction mayinclude not only a mechanical code generated by a compiler, but also ahigh-level language code executable on a computer using an interpreter.The above hardware unit may be configured to operate via one or moresoftware modules for performing an operation of the present disclosure,and vice versa.

A module or a program module may include at least one of the aboveelements, or a part of the above elements may be omitted, or additionalother elements may be further included. Operations performed by amodule, a program module, or other elements may be executedsequentially, in parallel, repeatedly, or in a heuristic method. Inaddition, some operations may be executed in different sequences or maybe omitted. Alternatively, other operations may be added.

While the present disclosure has been shown and described with referenceto various embodiments, it will be understood by those skilled in theart that various changes in form and details may be made therein withoutdeparting from the spirit and scope of the present disclosure, which isdefined, not by the detailed description and embodiments, but by theappended claims and their equivalents.

What is claimed is:
 1. An electronic device comprising: a displayincluding a display area and a connecting area extending from one sideof the display area; a flexible printed circuit board (FPCB) connectedwith the connecting area; a first module mounted on a first surface ofthe FPCB; and a back panel formed on a rear surface of the display,wherein the connecting area is bent such that the first module is apartfrom the display to face the display, and wherein an opening is formedin an area of the back panel, which corresponds to the first module. 2.The electronic device of claim 1, wherein the connecting area includespolyimide (PI), and wherein pixels of the display are not formed in theconnecting area.
 3. The electronic device of claim 1, wherein theconnecting area includes a part of a display panel of the display. 4.The electronic device of claim 1, wherein at least a part of theconnecting area is bent with a specified curvature.
 5. The electronicdevice of claim 1, further comprising: a second module mounted on asecond surface of the FPCB, which is opposite to the first surface. 6.The electronic device of claim 1, wherein the back panel includes anelectronic pen sensor layer.
 7. The electronic device of claim 1,wherein an area of the back panel, which surrounds the opening, isattached to the FPCB through an adhesive layer, and wherein the adhesivelayer includes a water-proof member which passes air and blocksmoisture.
 8. The electronic device of claim 1, wherein the first moduleis a pressure sensor.
 9. The electronic device of claim 1, wherein thefirst module includes at least one of a biometric sensor and a pressuresensor.
 10. The electronic device of claim 9, wherein the biometricsensor is configured to use at least one of a plurality of pixels, whichare included in the display, as a light source.
 11. The electronicdevice of claim 1, wherein the first module is a biometric sensor, andwherein at least one pressure sensor is mounted on the first surfacewhile being adjacent to the first module.
 12. The electronic device ofclaim 11, wherein the biometric sensor is activated if the at least onepressure sensor detects pressure having a specific value or more. 13.The electronic device of claim 1, further comprising: a buffer memberformed on a surface of the first module, which faces the display. 14.The electronic device of claim 1, further comprising: a display driverintegrated circuit disposed on one surface of the connecting area tocontrol the display.
 15. An electronic device comprising: a flexibleprinted circuit board (FPCB) including a planar area and a bent area; asensor mounted on a first surface of the planar area; a displayconnected with the bent area; and a back panel formed on a rear surfaceof the display, wherein the bent area is bent such that the sensor isapart from the display to face the display, and wherein an opening isformed in an area of the back panel, which corresponds to a position ofthe sensor.
 16. The electronic device of claim 15, further comprising: adisplay driver integrated circuit disposed on one surface of the planararea to operate the display.
 17. A display device comprising: a displaypanel having a plurality of pixels to display content; a flexible memberincluding a first area making contact with one surface of the displaypanel and a second area extending from the one surface of the displaypanel; a display driver integrated circuit disposed in the second areaof the flexible member; a flexible printed circuit board (FPCB)connected with the second area; a back panel formed on a rear surface ofthe display; and a biometric sensor mounted on one surface of the FPCB,wherein an opening is formed in an area of the back panel, whichcorresponds to the biometric sensor.
 18. The display device of claim 17,wherein the second area is bent such that the biometric sensor is apartfrom the display to face the display.